Hotmelt injection moulding technology for small and medium-sized cabling and connector batches:

Significantly more cost-effective than other injection moulding options

Low-pressure technology

Aluminium moulds

Direct application, even to sensitive components (boards, inductors, etc.)

The specifications can also be varied in terms of the softening point, operating temperature, bonding to the carrier material, viscosity, Shore A hardness, elongation after fracture and burning behaviour.

The hotmelt granulates we use are based on renewable raw materials that are solvent-free and can be worked using environmentally-friendly processes.

Typical applications for hotmelt moulding:

• Injection encapsulation of components (connectors)
• Strain relief by encapsulating the cable as it exits the connector
• Integration of electronics into cabling
• Logos and markings on the injection-moulded part
• Moderate costs, even for smaller batches
• Custom cable grommets
• Specialised cable kink protection